Microelectronics
Showing 49–63 of 63 results
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Automatic parallel seam sealer
AF1250 -
High speed automatic flip-chip bonding
Datacon Chameo & Quantum -
High-Performance Plasma Treatment for Batch Manufacturing
AP-1000 -
Material Fluid Mixer & Bubble Removal Process
Awatron 3 -
Wire Bonder for all Wire Bonding Methods (Fine & Heavy Wire)
BJ653 -
Hermetic Projection Welding System
Pulsar -
High speed automatic die bonding for leadframe and strip
Esec 2100 -
Large Area Wedge and Ball Bonding (Fine Wire)
BJ855/885 -
Compact Welding System
Alpha Series -
Fully Automatic Heavy Wire Wedge Bonder
BJ955/959 -
Advanced Glovebox Welding Systems
AX5000/MX2000 -
Fully Automatic Heavy Wire Bonder with Thermosonic Function
LSB959 -
Fully Automatic Heavy Wire Wedge Bonder with large working area
BJ985 -
Next-Gen Thermo Compression Bonding Technology
Datacon 9800 TC Next -
Dual-Head Leadframe Wedge Wire Bonder (Heavy Wire)
BJ931