Wire Bonder for all Wire Bonding Methods (Fine & Heavy Wire)


Product Description

A flexible Wire Bonder for manual or automatic bonding. The Bondjet BJ653, with its changeable bond heads, supports the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon. The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in development and for suppliers validating their product quality. The BJ653 is ideal for product samples, pre-production prototypes or small volume production runs utilising proven and reliable Hesse quality. The Bondjet BJ653 is part of the new bonder generation and offers the same handling regarding operation and look & feel as the larger industrial machines from Hesse. It is characterized by an open workspace, which achieves the same process result as in the larger production wire bonders. The Bondjet BJ653 may have a lower throughput than other Hesse bonders but offers greater flexibility while still delivering fully automatic wire bonding. The available bondheads for the BJ653 are identical to the bondheads for the Hesse production machines.

Key Features

  • Bondheads for all common wire materials.
  • Wear-free components with piezo technology
  • Maintenance-free flexure hinges.
  • Working area: X: 100 mm (3.9″); Y: 90 mm (3.5″); Z: 50 mm (2.0″)
  • Intelligent bondhead connecting system with integrated memory storing all calibration data: bondheads are interchangeable within a few minutes.
  • Optimized pattern recognition.
  • Use of all common wire spools.
  • Loop generator for customized loops.
  • Integrated, non-destructive pulltest for wire and ribbon (HBK, RBK).
  • Continuous, real-time monitoring of wire deformation, transducer current and frequency within programmable control limits.
  • Machine mobility by mounted rollers; as an option.

Technical Specification

  • Open working area BJ653: X: 100 mm (3.9″); Y: 90 mm (3.5″); Z: 50 mm (2.0″)
  • P-rotation: 440°
  • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz; programmable ultrasonic power output
  • Windows® Embedded operating system
  • Height of operator desk: 730 mm (29″)
  • Footprint: 1070 mm x 1020 mm x 1560 mm (42″ x 40″ x 61″) (W x D x H) incl. monitor
  • Weight: approx. 325 kg, depending on configuration.

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