Large Area Wedge and Ball Bonding (Fine Wire)


Product Description

High Speed Fully Automatic Fine Wire Bonder (Wedge-Wedge and Ball-Wedge). The Bondjet BJ855/885 is the latest generation of Hesse fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855/885 meets the increasing demands of wire bonding and supports the latest technology and smart functions such as bondhead memory or chip libraries. Typical applications are components in HF and RF technology, COB, MCM, hybrids, optical and automotive electronics. In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application. The Bondjet BJ855/885 define the latest state of technological development compared to the competition and are the benchmarked for automatic fine wire bonders.

Key Features

  • Wedge and Ball Bond Heads
  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
  • Automated bondforce calibration; a load cell prevents operator error and ensures robust processes
  • Innovative bondtool detection
  • Automated bondtool calibration without wedge gauge
  • Loop generator for individualized loops
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Flexible use of working area, e.g. with a number of bonding stations (manual loading or with indexers)
  • Up to 7 wires per second, depending on application and bondhead, e.g. wedge-wedge bondhead, 25 μm wire, 1 mm loop length, metallized wafer
  • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option

Technical Specification

  • BJ855: Working area X: 305 mm (12″); Y: 410 mm (16″)
  • BJ885: Working area X: 370 mm (14.5″); Y: 870 mm (34″)
  • Z travel: 31 mm (1.22″)
  • P rotation: 440°
  • Wedge-wedge bondhead 45°, 60°
  • Wedge-wedge bondhead 90° (deep access) for ribbon or wire
  • Ball-wedge bondhead
  • Wire: Al, Au, Ag, Cu, Pt: 12.5 μm – 75 μm
  • Ribbon: Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm
  • Loop generator for individualized loops
  • Loop form functions: constant wire length, constant loop height, individual loop shapes
  • Fine pitch (wedge-wedge): 40 μm inline, 25 μm staggered/dual line (depending on wire diameter and loop)

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