Wire Bonding

Wire bonding is a critical process in microelectronics and battery pack manufacturing. This process can be performed with a range of different wire diameters using various techniques, including ball bonding and wedge bonding, each suitable for different applications.

Modern wire bonders offer high precision and flexibility, with features like motorized axes for accurate placement and looping control. These wire bonding machines are designed for a range of production scales, from small-scale laboratory settings to high-volume manufacturing lines.

Advanced wire bonders also incorporate user-friendly interfaces, machine vision and software, enhancing ease of use and efficiency. The versatility of these systems allows for seamless switching between different wire bonding methods, catering to the diverse needs of industries such as semiconductor, aerospace, and medical device manufacturing.