Fully Automatic Wire Bonding

Advanced Fully Automatic Wire Bonders benefit from motorised X, Y, Z and Theta axis. Typically, utilising sophisticated machine vision, they are able to automatically navigate around complex work pieces, delivering exceptional levels of control and repeatability.

Our latest generation wire bonders offer high-speed, versatile solutions for fine and heavy wire & ribbon applications. Innovative quality tools such as Process Integrated Quality Control or Integrated Pull Test provide insights into bond quality not previously accessible with destructive testing. User-friendly software and exchangeable bond heads provide unmatched flexibility for various wire bonding processes. Elevate your microelectronics and semiconductor manufacturing with automated cutting-edge wire bonding technology.