Encapsulation and Singulation

In electronics manufacturing, multiple encapsulation technologies are available. Processes like hermetic sealing, coating and molding are utilised to address a range of application demands.
Hermetic sealing systems offer versatile solutions for welding and soldering across various lidding applications, while specialized coating systems provide precise lacquer application or potting. Molding systems typically cater to higher volume packaging demands with innovation, automation and reliability. Industrial Singulation systems offer integrated solutions for efficient component separation, reflecting the industry’s move towards more advanced manufacturing techniques.