PARMI 3D AOI & SPI

Accelonix Ltd welcomes PARMI to our PCBA Test and Manufacturing product portfolio

We are proud to announce that PARMI, a leading supplier of 3D AOI (Automated Optical Inspection) and 3D SPI (Solder Paste Inspection) technology has partnered with Accelonix to become the latest addition to our portfolio of world class PCBA Test and Manufacturing production equipment. The PARMI range of next generation 3D inspection systems are engineered to cut production times whilst delivering accurate and repeatable results. PARMI represents the perfect addition to the Accelonix portfolio of Advanced PCBA Test Equipment and offers capabilities that strongly complement our existing product offering.

Advanced Engineering Show 2018

Accelonix Ltd presents cyberTECHNOLOGIES and Dispensing and Potting Experts Scheugenpflug, at the Advanced Engineering Show 2018

At this years’ Advanced Engineering Show, hosted by the NEC Exhibition Centre in Birmingham, Accelonix exhibited the latest advances in dispensing and potting technology from Scheugenpflug, alongside the latest 3D Non-Contact Surface Measurement systems from cyberTECHNOLOGIES.

Commenting on the show, which took place between the 31st October and 1st November, Scott Wood, Managing Director of Accelonix, said:

“We are extremely pleased at the level of interest shown in our product portfolio at this years’ Advanced Engineering Show. It was great to welcome so many new customers onto our booth. There is clearly a great deal of relevance to the technologies we offer and customers seemed to really appreciate our ability to support multiple aspects of their assembly process. A great example of this, is the discussion relating to EV battery assembly, linking Scheugenpflug Material Dispensing and Hesse Heavy Wire Bonding technology for the electrical interconnection process.

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Enhance your Professional Development with the IMAPS UK Die Attach Workshop

This is a fantastic opportunity to attend a comprehensive learning experience covering all aspects of the Die Attach process. Join us to develop your expertise of Bare Semiconductor devises as we explore existing and cutting-edge technologies, materials and processes used for substrates and assemblies by the industry today. Taking this one step further, we will be hosting a Die Attach Surgery, welcoming delegates to collaborate and work with our industry experts! Held at the prestigious MTC facility in Coventry on Thursday 22nd November 2018, this workshop goes beyond training and involves key tutorials on cutting edge technologies hosted by expert presenters whilst providing opportunities to network with leading technology providers.