Die Bonding and Die Sorting

In semiconductor manufacturing, advanced die bonding and sorting processes are key to delivering quality and efficiency. Benchtop semi-automatic die attach bonders are tailored for small-scale production, offering easy operation and flexibility. Advanced automated systems cater to a range of demanding die attach needs, including flip chip and multi-chip bonding. Automated die sorters handle diverse input and output mediums with features like quick-change fixtures, enhancing flexibility in high-mix environments. Semi-automatic systems simplify sorting fragile devices, streamlining small lot production with user-friendly interfaces and efficient setup.