Fully Automatic Heavy Wire Wedge Bonder

BJ955/959

Product Description

The Bondjet BJ955 and BJ959 belong to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as fully automatic machines or operated manually. Capable of handling wire diameters from 50 μm up to 600 μm, these systems are incredibly flexible. Outstanding features include high speed and large bonding area. A change from aluminium to copper can be realized within minutes. Hesse GmbH has designed the only heavy wire bondhead with a non-destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity. In addition to a standard configuration Hesse offers automation concepts individually adapted for every application.

Key Features

  • 50 μm – 600 μm bondhead for Al, Cu, AlCu (2 mil – 24 mil)
  • Improved wire handling: short distance between bondhead and spool
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
  • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
  • Innovative bondtool detection
  • Wire spool detection
  • Automated bondtool calibration without wedge gauge
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM

Technical Specification

  • Working area BJ955: X: 305 mm (12″); Y: 410 mm (16.1″); Z: 42 mm (1.65″)
  • Working area BJ959: X: 370 mm (14.6″); Y: 560 mm (22.0″); Z: 42 mm (1.65″)
  • P-rotation: 440°
  • Bond heads: HBK (Frontcut, Backcut), RBK Ribbon (Frontcut), RBK Copper (Frontcut, Backcut) Frequency: 60 kHz*; alternative frequencies on request
  • Cutting methods: active, passive, air cut (for frontcut)
  • Wire: Al, Cu, AlCu: 50 μm – 600 μm
  • Ribbon: Al, Cu, AlCu: 250 μm x 25 μm up to 2000 μm x 400 μm (Cu: 200 μm)
  • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz

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