Automatic Fine Wire Bonder – Wedge and Ball
HB100
Product Description
The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis and bondhead rotation. Perfectly suited for laboratories and small volume productions. This versatile machine can perform wedge and ball bonding with a single bond head. With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control. In addition, the latest software technology supports the user with process guidance and bond assist features.
Key Features
- Motorized X, Y, Z and Theta axis
- Loop Profile Software with up to 10 steps
- Pattern Recognition – automatic position correction through machine vision (optional)
- Intuitive 21″ Interface with Touch Screen Control
- Simple change between Ball and Wedge Bonding
- Deep Access Bondhead
- Dual Camera System for Detail view and Overview at the same time
- Crash Prevention System for Z-Axis Touch Down
- Parameters Entered using Real Units of Force, Time and Power
- Broad range of Accessories like Heater stages and Top Plates
Technical Specification
- Gold & Aluminium Wire Diameter 17-75µm (0.7 – 3 mil)
- Ribbon Size up to 25×250µm (1×8 mil)
- X-Y Drive & Resolution linear motors 0.1µm
- 63.3kHz Transducer PLL Control (110kHz option)
- Ultrasonic Power 0-10 Watt Output
- Bond Time 0-5 seconds
- Bond Force 10-200cNm
- 90° Wire Feed Angle
- 100mm Motorized Z travel