Next-Gen Thermo Compression Bonding Technology
Datacon 9800 TC Next
Product Description
The 9800 TC next is the latest innovation in thermo compression bonding, designed to meet the evolving trends and stringent requirements of advanced packaging. Engineered for excellence, this system features significantly enhanced key performance indicators, ensuring superior results in every application.
Key Features
- Advanced Micro-Inert Chamber
Optimized for minimal gas consumption, this critical assembly ensures efficient operation and cost savings. - Unmatched Accuracy and Stability
Achieve precise bonding with long-term stability, perfect for advancing bump pitch scaling plans. - Powerful Bonding Capabilities
The 9800 TC next delivers bonding forces up to 500 N, with an optional upgrade to 1 kN, accommodating a variety of bonding needs. - High-Resolution Vision Systems
Ensures precise alignment and inspection, crucial for maintaining high quality standards. - Thin Die Capability
Expertly handles thin dies, expanding your application possibilities. - Superior Process Control
Advanced monitoring functions provide unparalleled control over the bonding process. - Configurable Material Feeding System: Offers incredible flexibility, allowing for customized material handling to suit diverse requirements.
- Modular Design for R&D and High Volume: Available as a dual-module machine for high-volume production or as a single-module system tailored for R&D purposes. The system is upgradeable, adapting seamlessly to evolving use cases.