Plasma treatment with online boat automation


Product Description

Designed for high-throughput, inline processing of microelectronic devices held in boats, trays or other carriers; ideal for pre-Flip-Chip Underfill (FCUF) processes. Unique boat bypass feature optimizes productivity, multiple inline plasma modules and production-ready dual-lane boat handling increase throughput. FlexTRAK-2MB system provides rapid material transfer, up to 2 boats per plasma cycle. Combined with the compact design and short plasma cycle.

Key Features

  • Seamlessly integrates into a production line.
  • Plasma processes for pre-flip chip underfill, pre-die attach, pre-wire bond and pre-mold steps.
  • Plasma contamination removal & cleaning.
  • Roughen surfaces to improve adhesion and reduced delamination.
  • Modify surfaces to increase bond strength and surface tension properties.
  • Improve flip chip underfill performance by minimizing voids, enhancing adhesion, increasing wicking speed and maximizing fillet height uniformity.

Technical Specification

  • Dimensions (W X D X H): 800 x 1530 x 1596 mm
  • Weight: 590 kg (1300 lbs)
  • Software Control: PLC Control with Windows Based Touch screen interface
  • Maximum Volume: 5.5 Liters
  • Working Area: 305 x 305 mm
  • Standard Wattage: 600 W
  • Maximum Number of MFCs: 3
  • Frequency: 13.56 MHz
  • Standard Wet Pump: 19.5 cfm with Oxygen Oil Mist Eliminator
  • Optional Purged Dry Pump: 16 cfm
  • N2 Purged Pump Flow: 2 slm
  • Power Requirements: 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire
  • Process Gas Fitting Size & Type: 6.35 mm OD Swagelok Tube
  • Process Gas Purity: Lab or Electronic Grade
  • Process Gas Pressure: 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated

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