Fully Automatic Vapor Phase Soldering System (Carrier Return System)
Condenso X-Line
Product Description
The CondensoX-Line by Rehm Thermal Systems is a sophisticated condensation soldering system that seamlessly integrates into standard SMD lines, offering a vacuum soldering process. This system is designed to produce void-free solder joints in a completely inert process environment, making it ideal for various applications, including standard assemblies with BGA components or DCB substrates for power electronics. The CondensoX-Line’s unique 3-chamber system enables low cycle times for inert soldering processes. Its final gas-tight cooling chamber uses variable convection to ensure controlled and rapid cooling of assemblies, meeting the highest requirements for series production of power electronics.
Key Features
- Integration into standard SMD lines with a vacuum soldering process
- Capable of producing void-free solder joints in a completely inert environment
- 3-chamber system for efficient cycle times in inert soldering processes
- Gas-tight cooling chamber with variable convection for controlled, rapid cooling
- Traceability and MES connection for full traceability of each assembly
- Suitable for standard assemblies with BGA components or DCB substrates for power electronics
- Process chamber suitable for vacuum and can be flooded with nitrogen or forming gases
- Option to use formic acid for flux-free process control
Technical Specification
- Maximum assembly size: 650 x 650 mm (W x L)
- Clearance: top 60mm (85mm) / bottom 20mm (0mm)
- Pre-chamber for nitrogen flooding and pre-inerting
- Less than 100 ppm O2 in the inert process environment
- ViCON Condenso software for intuitive operation, process monitoring, and documentation