Dual-Sided Flying Probe Tester New Generation
APT-2600F Series
Product Description
The APT-2600F series is a high-performance flying probe test system featuring 4 heads with 6 probes on the top and 2 heads with 4 probes on the bottom, allowing simultaneous dual-sided testing. This setup improves test coverage, reduces test time, and eliminates the need for board flipping, lowering the risk of damage. With models supporting large PCB sizes and automation, it provides a cost-effective solution for prototype to mass production, enhancing PCB assembly quality.
Key Features
- Dual-Sided Probing: Simultaneous top and bottom testing with up to 6 probes, improving test coverage and efficiency.
- Advanced Measurement System: 16-bit DC source and AC generator for optimal in-circuit and functional testing.
- Zero-Impact Probe Control: Slows probe speed before contact to reduce stress and prevent board damage.
- High-Resolution Vision System: Equipped with liquid lens technology for clear imaging and 3D mapping of complex areas.
- Temperature Sensor: Detects semiconductor failures and compensates for temperature drift.
- Distance Sensor: Measures PCB and component heights to detect lifted parts and ensure accurate contact.
- LED Color Sensor: Detects emission color variations, enhancing LED inspection precision.
- Multi-Probe System: Supports simultaneous bottom-side contacts, integrating with external devices like ISP.
- Industry 4.0 Ready: Integrates with factory networks for traceability and fast issue response.
- Automatic Probe Cleaning: Built-in cleaner removes contaminants, maintaining test accuracy.
Technical Specification
- Model Options: Standard and large size configurations available.
- Dual-Sided Probes: Top probes include 4 tilted, 2 vertical, and 2 IC-open probes; bottom probes are 3 fixed vertical probes with magnetic base.
- Testable PCB Sizes: Accommodates PCB dimensions up to 985 mm x 610 mm.
- Component Height: Top components up to 60 mm; bottom components up to 120 mm.
- Component-Free Area: Minimum clearance of 3 mm (7 mm for large models).
- Testing Speed: Single test speed of 0.05-0.06 sec/step; combination test at 0.02-0.03 sec/step.
- Positioning Accuracy: XY positioning repeatability within ±25 µm.
- Minimum Pad Size: Compatible with pad sizes as small as 50 µm.
- Minimum Pad Pitch: Supports pitches down to 150 µm for dense components.
- Weight: Standard model at 5 kg, large model at 15 kg.