Single Sided Flying Probe Tester New Generation

APT-2400F Series

Product Description

The APT-2400F series is an advanced flying probe test system designed for precise and rapid testing of PCB assemblies. Equipped with 4 heads and 6 flying probes, it efficiently handles high-density boards by reaching hard-to-access test points, enabling in-depth assembly testing and fault analysis. Its adaptable design supports both small and large PCBs and integrates seamlessly with automated production lines, offering cost-effective testing from prototyping to mass production while ensuring high assembly quality.

Key Features

  • Enhanced Test Coverage: Features 4 heads with 6 flying probes, including 2 vertical and 4 angled probes, to reach challenging test points.
  • Sophisticated Measurement System: Uses a 16-bit DC source and AC generator, providing in-circuit and functional testing with optimal measurement accuracy.
  • Impact-Minimizing Probe Control: Slows probe speed to zero before contact, reducing stress on contact points and preserving board integrity.
  • High-Resolution Vision System: Equipped with a camera and liquid lens technology, offering clear imaging across varying component heights for OCR and AOI.
  • 3D Imaging Capability: Generates 3D real maps for checking top-to-bottom net connections and areas that are difficult to inspect.
  • Temperature Sensor: Measures V-I curves and performs non-contact measurements for enhanced detection of component failures.
  • LED Color Sensor: Detects LED color variations by measuring hue, saturation, and brightness, ensuring precise inspection without extra fixtures.
  • Industry 4.0 Compatibility: Integrates with factory networks, enabling quick traceability, inspection visualization, and efficient issue resolution.
  • IC-OPEN Solder Failure Detection: Detects solder issues on IC leads within bus circuits, addressing a common challenge with QFP and BGA inspections.
  • Automatic Probe Cleaning: Built-in cleaner removes contaminants from probe tips at preset intervals, ensuring stable and accurate testing results.

Technical Specification

  • Model Options: Available in standard and large sizes to accommodate different PCB dimensions.
  • Testable PCB Sizes: Supports a maximum PCB size of up to 985 mm x 610 mm.
  • Probes Configuration: Top probes include 4 tilted and 2 vertical probes, while the bottom features 3 fixed probes with magnetic bases.
  • Component Height: Maximum component height of 60 mm on the top and 120 mm on the bottom.
  • Component-Free Area: Minimum required area of 3 mm on both sides (7 mm optional for large configurations).
  • Test Speed: Single test at 0.05-0.06 seconds per step; combination test at 0.02-0.03 seconds per step.
  • Positioning Precision: Flying probe positioning repeatability within ±25 µm.
  • Minimum Pad Size: Capable of testing on pads as small as 50 µm.
  • Minimum Pad Pitch: Handles pad pitches down to 150 µm for fine-pitch applications.
  • System Weight: Standard models weigh around 5 kg, while large models can reach up to 15 kg.

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