3D X-RAY AND COMPUTED
LAMINOGRAPHY INSPECTION SERVICES
Uncover hidden defects with our advanced 3D X-ray inspection solutions,
backed up by our expertise in non-destructive testing.
Comprehensive, Reliable, and Non-Destructive Inspection Services
At Accelonix UK & Ireland, we offer advanced 3D X-Ray and Computed Laminography (CT) inspection services, providing a dependable, non-destructive testing solution for electronic, microelectronic, electromechanical, and other small products. Our services are ideal for clients who do not possess their own inspection machinery, ensuring you receive precise and detailed analysis without the need for significant equipment investment.
Why Choose Our Advanced Inspection Services?
Unparalleled Insight: Gain deeper understanding of internal structures and components without disassembly.
Defect Detection: Identify critical defects such as cracks, open solder joints, voids, and more.Identify critical defects such as cracks, open solder joints, voids, and more.
Root Cause Analysis: Perform comprehensive failure analysis to improve product reliability.
Non-Destructive Inspection: Preserve the integrity of your products while obtaining detailed insights.
Expert Analysis: Leverage our team’s expertise for accurate interpretation of inspection results.
Our Comprehensive Inspection Services
X-Ray Inspection
Our X-Ray inspection capabilities enable detailed examination of semiconductor components and electronic devices, such as solder joints, without requiring device disassembly. This service is essential for:
Identifying Hidden Defects: Detect cracks, open solder joints, voids, and other anomalies that are not visible externally.
Ensuring Product Integrity: Maintain high-quality standards by verifying the internal condition of components.
Enhancing Quality Control: Integrate non-destructive testing into your quality assurance processes.
Computed Laminography (CT)
Our CT systems provide the highest-resolution 3D non-destructive failure analysis of semiconductor devices. This advanced technique allows for:
Deep Insight into Internal Structures: Visualize complex internal geometries with exceptional clarity.
Accurate Defect Identification: Pinpoint defects and irregularities that could affect performance.
Root Cause Analysis: Facilitate thorough investigation to address issues at their source.
Our Comprehensive Inspection Services
We offer a complete range of inspection services to ensure the quality and reliability of your products:
Wafer and SMD Inspection: Detect defects in bond wires, cavities, solder joints, and components.
Through-Hole Technology (THT) Inspection: Evaluate THT components for quality assurance.
Multilayer PCB Inspection: Verify layer alignment, detect interconnect defects, and assess metallization quality.
Assembled PCBA Inspection: Identify solder joint issues such as voids and bridges to improve quality.
Specialized Component Inspection: Examine power electronics components and sensors for internal defects.
Battery Cell Inspection: Inspect battery cells for internal defects to ensure safety and optimal performance.
Comprehensive Reporting
We provide a dedicated summary report, generated on our Comet Yxlon system, including:
Detailed Imagery: High-resolution images specific to your requirements.
Precise Measurements: Data tailored to your needs for accurate analysis.
Expert Interpretation: Insights and recommendations from our experienced engineers.
Why Partner with Accelonix UK & Ireland?
Access to Cutting-Edge Technology: Utilize advanced X-Ray and CT inspection systems without significant investment.
Expert Analysis: Benefit from our team’s extensive experience in non-destructive inspection.
Customized Solutions: Receive services tailored to your specific needs and industry requirements.
Enhance Product Quality: Ensure the highest reliability and performance of your electronic components and assemblies.
Cost-Effective Services: Avoid the expenses associated with purchasing and maintaining complex inspection equipment.