Plasma for High-Throughput Wafer and Panel-Level Packaging
StratoSPHERE
Product Description
The StratoSPHERE™ is a high-throughput plasma treatment system for processing up to 300 mm (12 in.) semiconductor wafers. The patented plasma chamber design provides exceptional etch uniformity, process repeatability, cycle-time performance, and minimal cost of ownership. Its three-axis symmetrical chamber ensures uniform treatment of all wafer areas, and tight control over process parameters ensures highly repeatable results.
The StratoSPHERE offers industry-leading throughput and reliability for semiconductor manufacturing applications, designed to last and provide cutting-edge capabilities continuing a time-honoured tradition.
Key Features
Wafer Cleaning
- Remove contamination before wafer bumping
- Remove organic contamination
- Remove fluorine and other halogen contamination
- Remove metal and metal oxides.
- Improve spun-on film adhesion
- Clean metallic bond pads
Wafer Etching
- Descum wafer of residual photoresist/BCB.
- Pattern dielectric layers for redistribution
- Strip/etch photoresist.
- Enhance adhesion of wafer-applied materials
- Remove excess wafer-applied mold/epoxy
- Enhance adhesion of gold solder bumps
- Destress wafer to reduce breakage
- Improve spun-on film adhesion
- Clean Aluminum bond pads
Technical Specification
- Dimensions (W X D X H): 1405 x 2615 x 1742 mm
- Weight: 480 kg (1058 lbs)
- Process Module EFEM Weight: 640 kg (1411 lbs)
- Software Control: PLC Control with Windows Based Touch screen interface
- Maximum Volume: 5.5 Liters
- Chuck Configurations: 200 – 300 mm substrate sizes
- Working Area: 305 x 305 mm
- Standard Wattage: 600 W
- Maximum Number of MFCs: 3
- Frequency: 13.56 MHz
- Standard Wet Pump: 16 cfm with Oxygen Oil Mist Eliminator
- Optional Purged Dry Pump: 16 cfm
- N2 Purged Pump Flow: 2 slm
- Power Requirements: 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire
- Process Gas Fitting Size & Type: 6.35 mm OD Swagelok Tube
- Process Gas Purity: Lab or Electronic Grade
- Process Gas Pressure: 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated