In today’s electronics manufacturing landscape, contract manufacturers (CMs) face increasing pressure to deliver high-quality products quickly, efficiently, and cost-effectively. With shrinking component sizes, complex multi-layer boards, and high-density packaging like Ball Grid Arrays (BGAs) and Package-on-Package (PoPs), traditional inspection methods are often no longer sufficient. Accelonix UK & Ireland proudly distributes the Comet Yxlon Cheetah EVO and Cougar X-ray inspection systems, offering advanced solutions to electronic manufacturers seeking non-destructive testing (NDT) technologies.
Enter X-ray Computed Laminography (CL)—a cutting-edge, non-destructive inspection technique designed to deliver high-resolution internal imaging of flat, high-aspect-ratio structures. Unlike conventional computed tomography (CT), in CL, specific to the Comet Yxlon Cheetah EVO & Cougar machines, the sample is rotated about a virtual axis parallel to the Z-axis on a flat, X-ray-transparent stage, while the detector is tilted to enable off-axis image acquisition. This geometry ensures that, during rotation, X-rays primarily pass through the thinnest dimension of flat, high-aspect-ratio components such as multilayer PCBs and bottom-terminated devices. The reduced path length improves contrast and signal-to-noise ratio by minimizing attenuation. Additionally, the ability to position the X-ray source close to the area of interest enhances resolution, enabling precise, non-destructive analysis of internal structures with fewer artefacts than conventional CT.
Systems such as the Cheetah EVO by Comet Yxlon are making CL technology accessible to many contract manufacturers. Let’s explore the top five benefits of X-ray Computed Laminography and why it’s becoming a vital tool on the modern shop floor.
1- High-Resolution Imaging for Double-Sided Boards
Traditional X-ray CT systems often struggle with flat, layered electronics due to image distortion and artefacts. X-ray Computed Laminography (CL) overcomes these limitations by optimizing image acquisition specifically for flat assemblies such as multilayer PCBs, embedded components, and Package-on-Package (PoP) stacks.
One key advantage of CL becomes evident when inspecting double-sided boards populated with high-density components. In such cases, conventional 2D X-ray systems—especially those using oblique viewing angles—cannot clearly isolate features on one side of the board if obstructed by components on the opposite side. This makes identifying voids, solder defects, or other faults extremely difficult. CL solves this by generating a 3D volume of the scanned region, allowing users to virtually “slice” through the structure and focus on the specific layer or component of interest—faster than with conventional CT.
Advanced systems such as the Cheetah EVO further enhance these benefits with features like:
- Precision laminography motion control: Enables definition of a virtual centre of rotation, allowing high-quality scans at any position on the stage—not just the centre.
- High-resolution flat-panel detectors: Optimized for speed and image quality, ensuring sharp, detailed results in minimal time.
- Automated positioning for repeatable scans: Ensures consistent imaging across repeated inspections with minimal user intervention.
2- Non-Destructive Defect Detection and Failure Analysis
In contract manufacturing, where time and material costs are tightly managed, the ability to perform non-destructive inspection (NDI) is invaluable. CL allows operators to inspect internal assemblies without cutting or altering the product—preserving the part while providing deep insights into:
- Voids in solder joints
- Delamination in PCB layers
- Cracks or bridging beneath bottom-terminated devices
The Cheetah EVO’s laminography capabilities, paired with intelligent software algorithms, streamline this process—empowering engineers to troubleshoot complex failures with greater speed and accuracy. The system’s intuitive software enables real-time inspection of BGA void percentages, THT fill, and voids in solder fill. These measurements can also be automated, further improving efficiency.
3- Faster Root Cause Analysis = Reduced Downtime and Scrap
Production bottlenecks caused by hard-to-identify defects can result in significant losses in both yield and customer satisfaction. X-ray Computed Laminography accelerates root cause analysis by delivering high-fidelity 3D images of internal structures—especially in areas traditional 2D X-ray might miss.
For instance, during New Product Introduction (NPI) phases or first-article inspections, systems like the Cheetah EVO can:
- Rapidly isolate fault locations
- Reduce the guesswork in rework
- Prevent unnecessary scrap and production stoppages
This translates to higher throughput and better first-pass yield—critical KPIs for contract manufacturers managing multiple customer builds.
4- Ideal for High-Mix, Low-Volume Production Environments
Flexibility is key in contract manufacturing, where teams must often inspect a wide variety of assemblies daily. CL systems must adapt quickly, without extensive retraining or complex setup.
The Cheetah EVO is designed with this flexibility in mind:
- Intuitive user interface: Ensures fast learning curves
- Automated calibration and inspection routines: Minimize manual intervention
- Scalable software: Integrates seamlessly into diverse workflows
This adaptability allows inspection teams to remain agile—switching between job types while maintaining high quality and traceability standards.
5- A Future-Ready Platform with AI and Automation Potential
Looking ahead, the value of CL will only continue to grow. With ongoing developments in Artificial Intelligence (AI), machine learning, and advanced reconstruction software, CL platforms are evolving into intelligent inspection hubs.
Comet Yxlon’s acquisition of DragonFly in 2020 positions the company at the forefront of automated defect recognition—especially in the hybrid bonding environments of semiconductor fabs. DragonFly is a leading performer in AI-powered segmentation and analysis. The recent release of DragonFly 3D View brings this advanced capability to X-ray inspection systems, helping customers transition into a world of automated, intelligent analysis.
Contract manufacturers adopting CL today are positioning themselves to remain competitive and compliant as quality expectations and traceability requirements continue to rise.
Conclusion:
X-ray Laminography Is an Investment in Speed, Accuracy, and Reliability As electronic assemblies become more compact and complex, the need for precise, non-destructive internal inspection continues to grow. X-ray Computed Laminography, especially when implemented with robust platforms like the Cheetah EVO from Comet Yxlon, offers contract manufacturers a powerful tool to meet today’s inspection demands—while preparing for tomorrow’s innovations. To better understand the capabilities of the Cheetah EVO system, customers are welcome to arrange a visit to our demonstration facility in Cambridge. For those evaluating X-ray inspection technology or facing specific challenges with PCB assemblies or products, our in-house inspection service offers a practical and cost-effective way to access high-resolution imaging and non-destructive testing—without the need for immediate capital investment.
