The latest TPT software release for HB16, HB10, HB30, and HB75 wirebonding and die bonding systems marks a major step forward in microelectronics manufacturing. Now powered by a Linux-based operating system, this update delivers greater flexibility, faster performance, and enhanced control—setting a new benchmark for precision bonding technology.
True to TPT’s engineering philosophy, every machine and software upgrade is designed to make the operator’s job easier and more intuitive. From initial setup to process optimisation, technicians can focus on fine-tuning performance rather than navigating complex interfaces. Every interface is user-focused, ensuring operators can quickly adapt and efficiently manage bonding processes. The result: a more efficient workflow and consistent, high-quality bond results.
Next-Generation Features for Next-Level Control
The Linux-based software platform brings a series of upgrades designed to streamline workflow, simplify programming, and improve process accuracy:
- Wire Playlist Mode – Create programs with any number of wires, each with its own bonding, tail, loop parameters, and adjustable search heights. In the software, a wire represents a complete bonding sequence—covering the first and second bond, loop height, tail parameters, and other process conditions. Each wire can be renamed, copied, or removed, making it easy to manage complex bonding sequences. For example, in devices with multiple modules or varied pad heights, each wire can have distinct parameters to ensure precise bonding. This mode is particularly useful for recurring samples, prototypes, or small production runs, giving engineers complete control over each connection within a program.
Example in the images show wire 3 of 5 selected from wire playlist. For this selected wire, you can change the bonding parameters, loop parameters, tail parameters and also the different heights by doing a Height Setup. This is especially helpful when you have a device with different modules on it (example below).
- New Pull Test Mode – Allows quick and repeatable bond strength testing directly on the machine. In previous software versions, there was no dedicated pull test mode – operators performed manual breaks using the Z lever or by triggering movement through the Dynamic Search button. The process, while functional, relied on manual control and operator precision. With the introduction of the new Pull Test mode, the bondhead movement during the break is now fully controlled through the machine interface, allowing consistent motion and repeatable results. Operators can switch to Pull Test mode via the machine menu, perform controlled tests using the bonding puck, and view precise breaking loads on the gauge. This enhancement simplifies quality assurance, especially in R&D and low-volume production where verifying bond integrity is essential.
- USB Program Management – Save and load bonding programs using an external USB drive for easy backup, transfer, and recovery. For manufacturers operating multiple HB machines, this allows straightforward program transfer between systems, enabling teams to ramp up production or relocate product lines without compromising process consistency. Both individual programs and full program lists can be managed easily.
- Adjustable Parameters for Greater Control – Operators can now fine-tune Search Height, Basic Force, and Feed Ultrasonic parameters, enabling faster optimisation for different wire materials, pad surfaces, and bonding geometries. These refinements ensure consistent quality even in challenging or highly variable applications.
Driving Innovation in Microelectronics Manufacturing
In modern microelectronics—where precision is measured in microns—these software upgrades deliver measurable advantages. Whether developing die attach processes or advanced packaging solutions, engineers benefit from smoother program switching, reduced setup time, and improved process yield.
The Linux-based architecture not only enhances speed and stability but also enables bespoke customer customisations. TPT works closely with customers to implement unique interface requirements and specialised software features for individual packaging needs, removing previous technical barriers and ensuring every system supports the user’s specific process requirements. Supporting Innovation Through Usability
This software release underscores TPT’s dedication to empowering users across academia, R&D, and production with the tools needed to meet evolving challenges in microelectronics manufacturing. With these improvements, the HB series continues to set the standard for flexibility, accuracy, and user-focused design in modern wirebonding.
Ready for Upgrade or Demonstration
All TPT HB16, HB14, HB12, and HB10 machines shipped since 2020 can be upgraded to the new Linux-based software. To discuss your upgrade options or custom integration needs, please contact the Accelonix UK sales team.
If you haven’t yet experienced a TPT wirebonder in action, we invite you to arrange a demonstration at our Cambridge facility. Discover firsthand how intuitive operation, precision control, and powerful new software make the HB series the go-to solution for microelectronics R&D and production environments.
