APT-1400 intro text...

Metrology Services
Sorry, your browser does not support inline SVG.

Accelonix Ltd have extended their contract testing capabilities to include surface measurement of electronic board, wafer and component testing. This compliments the existing services for low, medium and high volume board testing. The Staplehurst facility has a 2 and 3D non-contact surface measurement system from Cyber Technologies Gmbh.

Key measurement capabilities include:

Thickfilm measurement of surface layers including hybrid, solar cell, epoxy print, MLCC and fuel cells for profile and thickness.

Flatness for Electronic components, sensors, silicon wafers and hard disc drive components.

Surface roughness for measurement of etching and surface defect detection.

Transparent film and deposit measurement such as flux and epoxy, including substances not visible with microscopy or AOI systems.

Coplanarity for SMT components and Micro BGA.

Thickness for absolute measurement and TTV, bending and Warpage for wafers and components

CT100 measurement capacity

The CT100 system is a scanning point based confocal white light non-contact surface measurement system.
Key Features are
  • Moving platform travel range 150mm x 150mm
  • Motorized Z-axis to 30mm product height
  • Spot size 3.5um
  • Measurement range 1mm with range extension for seemless contoured product testing
  • Resolution to 35nm vertical and 1.5um horizontal
  • Working height above measured surface 20.8mm
  • Maximum feature height 19.5 mm above surface
  • Reporting options include SPC, 3D image production
  • Traceable calibration and certfication

Why Choose Accelonix:

  • Fast Turn-Around Program Generation and Testing Service
  • Low Cost Solutions
  • Prototypes , Pilot Runs and Low to Medium Volumes catered for
  • Full Traceability of Batches Tested
  • Board Testing of Areas up to 150mm x 150mm
  • Dedicated Point of Contact Assigned to Your Project

Learn more about the CT100 Non Contact Profilometer here:

CT100 Non Contact Profilometer