Ultra-precise hybrid bonding for advanced packaging
Datacon 8800 CHAMEO Ultra Plus AC
Product Description
The Datacon 8800 CHAMEO ultra plus AC is Besi’s advanced hybrid bonding platform, combining ultra-high placement accuracy with high throughput. Designed for next-generation packaging and high-end modules, it enables reliable 3D integration and dense interconnects. Innovative cleanliness management and precision optical alignment ensure consistently high performance.
Besi supports customers throughout the hybrid bonding process, from material preparation to metrology, helping build robust production capabilities with optimal yield. Live demonstrations and sample builds are available in our labs in Singapore and Austria. Contact us to schedule a visit.
Key Features
- “Van Gogh” alignment for ultra-high placement accuracy with high-resolution cameras
- ISO 3 cleanroom environment in the bonding area to ensure high yield
- Integrated thin die handling and alternative ejection solutions
- Inline IR inspection for immediate feedback and improved throughput
- Multi-chip handling with automatic tool-changing system
- Full factory automation with host-triggered changeover and data monitoring
- Stand-alone or cluster integration with Applied Materials EFEM solution
Technical Specification
- Placement accuracy: 100 nm @ 3 sigma (worst corner, GOG)
- Accuracy self-check: Single BMC kit
- Cleanroom level: ISO 3 in working area
- Throughput: Up to 2,000 CPH (dry cycle)
- Substrate wafer size: 12″ via EFEM
- Substrate wafer thickness: 0.5 to 2.0 mm
- Wafer handling: 12″ film frame or wafer carrier (silicon or glass)
- Die size: 0.5 × 0.5 mm to 33 × 28 mm
- Die thickness: 25 µm to 800 µm
- Die ejection methods: Needle, multi-stage, UV (on request)