Semi-Automatic Die Bonder



Product Description

The HB75 is a bench top size semi-automatic Die Attach Bonder, ideal for laboratories, pilot and small-scale production lines. Easy operation is achieved via a TFT touch screen for direct access and simple adjustment of all parameters. It is a flexible system, easily tailored towards your die bonding needs. The system is equipped with a rotating head for quick change during die-placement. Epoxy can be dispensed or stamped.

Key Features

  • Die placement with precise movements
  • Epoxy stamping and optional Epoxy dispensing
  • Rotational head for quick switch between Die Attach dispensing and Die Placement
  • Pick Die from Waffle Packs and place on to your substrate
  • 6.5″ TFT Touch Screen
  • Semi-automatic and Manual modes
  • True Vertical Movement
  • Integrated Vacuum pump

Technical Specification

  • Min Die Size: 100um x 100um
  • Max Die Size: 10mm x 10mm
  • Bond time: 1ms – 10,000ms (1ms – 20,000ms optional)
  • Bond Force: 10-150cNm ( 350cNm optional)
  • Motorised Z- way: 17mm (0.67″)
  • Bond Arm Length: 165mm (6.7″)
  • X-y Manipulator: 10mm (0.4″)
  • Tempearture Control: Up to 250degC +/- 1degC

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