Semi-Auto Heavy Wire bonder – Wedge


Product Description

The HB30 is a bench top size heavy wire bonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

Key Features

  • Motorised Z Bondhead
  • Motorised Y travel for Step-Back Control
  • Intuitive Interface with Touch Screen Control
  • Stitch Bonding
  • Built-in Dual Fibre Optic Illuminator
  • Loop Profile Software
  • Semi-Automatic, Step and Manual Bonding Mode
  • 100 Program Storage Capacity

Technical Specification

  • Aluminium Wire Diameter 100µm – 500µm
  • Ribbon Sizes up to 300µm x 2000µm
  • Ultrasonic Power 20 Watt Output
  • PLL US System
  • Bond Time 0-10 seconds
  • Bond Force 5-1500cNm
  • 90° Wire Feed Angle
  • Loop profiles consisting of up to 10 steps

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