Semi-Auto Heavy Wire bonder – Wedge
HB30
Product Description
The HB30 is a bench top size heavy wire bonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.
Key Features
- Motorised Z Bondhead
- Motorised Y travel for Step-Back Control
- Intuitive Interface with Touch Screen Control
- Stitch Bonding
- Built-in Dual Fibre Optic Illuminator
- Loop Profile Software
- Semi-Automatic, Step and Manual Bonding Mode
- 100 Program Storage Capacity
Technical Specification
- Aluminium Wire Diameter 100µm – 500µm
- Ribbon Sizes up to 300µm x 2000µm
- Ultrasonic Power 20 Watt Output
- PLL US System
- Bond Time 0-10 seconds
- Bond Force 5-1500cNm
- 90° Wire Feed Angle
- Loop profiles consisting of up to 10 steps