Plasma for High-Throughput Wafer and Panel-Level Packaging


Product Description

The StratoSPHERE™ is a high-throughput plasma treatment system for processing up to 300 mm (12 in.) semiconductor wafers. The patented plasma chamber design provides exceptional etch uniformity, process repeatability, cycle-time performance, and minimal cost of ownership. Its three-axis symmetrical chamber ensures uniform treatment of all wafer areas, and tight control over process parameters ensures highly repeatable results.

The StratoSPHERE offers industry-leading throughput and reliability for semiconductor manufacturing applications, designed to last and provide cutting-edge capabilities continuing a time-honoured tradition.


Key Features

Wafer Cleaning

  • Remove contamination before wafer bumping
  • Remove organic contamination
  • Remove fluorine and other halogen contamination
  • Remove metal and metal oxides.
  • Improve spun-on film adhesion
  • Clean metallic bond pads

Wafer Etching

  • Descum wafer of residual photoresist/BCB.
  • Pattern dielectric layers for redistribution
  • Strip/etch photoresist.
  • Enhance adhesion of wafer-applied materials
  • Remove excess wafer-applied mold/epoxy
  • Enhance adhesion of gold solder bumps
  • Destress wafer to reduce breakage
  • Improve spun-on film adhesion
  • Clean Aluminum bond pads

Technical Specification

  • Dimensions (W X D X H): 1405 x 2615 x 1742 mm
  • Weight: 480 kg (1058 lbs)
  • Process Module EFEM Weight: 640 kg (1411 lbs)
  • Software Control: PLC Control with Windows Based Touch screen interface
  • Maximum Volume: 5.5 Liters
  • Chuck Configurations: 200 – 300 mm substrate sizes
  • Working Area: 305 x 305 mm
  • Standard Wattage: 600 W
  • Maximum Number of MFCs: 3
  • Frequency: 13.56 MHz
  • Standard Wet Pump: 16 cfm with Oxygen Oil Mist Eliminator
  • Optional Purged Dry Pump: 16 cfm
  • N2 Purged Pump Flow: 2 slm
  • Power Requirements: 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire
  • Process Gas Fitting Size & Type: 6.35 mm OD Swagelok Tube
  • Process Gas Purity: Lab or Electronic Grade
  • Process Gas Pressure: 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated

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