Dedicated Wire Pull Bond Tester
610
Product Description
The Royce 610 Dedicated Wire Pull Bond Tester is designed for maximum quality at an affordable cost, packaged in a reliable system. The controls of the 610 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 610 easily adjusts to accommodate a broad spectrum of users.
Key Features
- The familiar controls make training quick and easy, minimizing downtime
- Includes the standard computer mouse controls with: the hook, height and rotation, along with triggering the test
- A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe
- Able to perform both destructive and non-destructive tests, the 610 collects force data against the wire every 10 microseconds
- When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum
- Non-destructive testing is controlled so that the rate of load application exactly meets the user’s programmed limit
- Load variance also is programmable by the user prior to testing to provide stricter controls
- Data output to any PC using RS232
- Ergonomic design to support operator comfort over long shifts
- Simple calibration interface to allow user to quickly and easily check and recalibrate the instrument with on-screen instructions
- Optional strip printer
- Optional keypad for enhanced failure code input
- Optional external royce PC with bond test manager software for data storage and networking
Technical Specification
- Maximum Wire Pull Test Force: 100 gf
- Total System Accuracy: ±0.1%
- Z Resolution: ±2.5 μm
- Computer: Optional External Windows 7 PC with Bond Tester Manager
- Part Manipulation: Manual Manipulators (MPS-12 and MPS-14)