Dedicated Wire Pull Bond Tester


Product Description

The Royce 610 Dedicated Wire Pull Bond Tester is designed for maximum quality at an affordable cost, packaged in a reliable system. The controls of the 610 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 610 easily adjusts to accommodate a broad spectrum of users.

Key Features

  • The familiar controls make training quick and easy, minimizing downtime
  • Includes the standard computer mouse controls with: the hook, height and rotation, along with triggering the test
  • A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe
  • Able to perform both destructive and non-destructive tests, the 610 collects force data against the wire every 10 microseconds
  • When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum
  • Non-destructive testing is controlled so that the rate of load application exactly meets the user’s programmed limit
  • Load variance also is programmable by the user prior to testing to provide stricter controls
  • Data output to any PC using RS232
  • Ergonomic design to support operator comfort over long shifts
  • Simple calibration interface to allow user to quickly and easily check and recalibrate the instrument with on-screen instructions
  • Optional strip printer
  • Optional keypad for enhanced failure code input
  • Optional external royce PC with bond test manager software for data storage and networking

Technical Specification

  • Maximum Wire Pull Test Force: 100 gf
  • Total System Accuracy: ±0.1%
  • Z Resolution: ±2.5 μm
  • Computer: Optional External Windows 7 PC with Bond Tester Manager
  • Part Manipulation: Manual Manipulators (MPS-12 and MPS-14)

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