Contact Soldering with/without Vacuum (Nitrogen, Forming Gas)

Nexus

Product Description

The Nexus from Rehm Thermal Systems is a specialized system designed for flux-free vacuum soldering of pastes and preforms. Operating at temperatures up to 450°C, it is adept at joining diverse materials reliably. The vacuum environment minimizes oxidation on components and joints, enhancing the quality of soldering. The Nexus achieves heat transfer through thermal conduction and, optionally, radiation. Its individually programmable temperature regulation allows for flexible processing and short cycle times. The system can use various process gases, including nitrogen, forming gas, and formic acid, and is equipped with a residue management system for efficient cleaning when using soldering paste containing flux. Compact and user-friendly, the Nexus is ideal for small to medium-scale production and laboratory settings.

Key Features

  • Specialized for flux-free vacuum soldering of pastes and preforms
  • Minimized oxidation in components and joints due to vacuum environment
  • Flexible processing with individually programmable temperature regulation
  • Compatibility with various process gases including nitrogen, forming gas, and formic acid
  • Suitable for small to medium-scale production and laboratory use
  • Efficient residue management system for cleaning process gas
  • Compact dimensions for space efficiency
  • Manual front loading with interchangeable product carriers
  • Vacuum ensures oxide-free processes and improved wetting of soldered joints

Technical Specification

  • Accommodates assemblies: up to 500 x 540mm (W x L)
  • Heating rate: max. 150K/min and cooling rate of max. 180K/min
  • High operating temperatures: up to 450°C for reliable material joining
  • ViCON Nexus software for intuitive operation, process monitoring, and documentation

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