Benchtop Manual Fine Wire Bonder – Wedge and Ball
HB05
Product Description
The HB05 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small-scale production lines. The system is configured with a single bond head for ball and wedge bonding – no bond head change is required. An intuitive user interface provides the user with access to all bond parameters and bonding recipes stored on the machine.
Key Features
- Motorized Tail Control
- 4″ TFT Display for Easy Control of all Bond Parameters
- Simple Change between Ball Bonding and Wedge Bonding
- Deep Access Bond head
- Electronic Wire Clamp for Precise Tail Length Control
- Easy Setting Recall when Working on Different Applications
Technical Specification
- Gold Wire Diameter 17-75µm (0.7 – 3 mil)
- Aluminium Wire Diameter 17-75µm (0.7 – 3mil
- Ribbon Size up to 25×250µm (1×8 mil)
- 62kHz Transducer PLL Control
- Ultrasonic Power 0-5 Watt Output
- Bond Time 0-1 seconds
- Bond Force 5-130cNm
- 90° Wire Feed Angle