Benchtop Manual Fine Wire Bonder – Wedge and Ball

HB05

Product Description

The HB05 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small-scale production lines. The system is configured with a single bond head for ball and wedge bonding – no bond head change is required. An intuitive user interface provides the user with access to all bond parameters and bonding recipes stored on the machine.

Key Features

  • Motorized Tail Control
  • 4″ TFT Display for Easy Control of all Bond Parameters
  • Simple Change between Ball Bonding and Wedge Bonding
  • Deep Access Bond head
  • Electronic Wire Clamp for Precise Tail Length Control
  • Easy Setting Recall when Working on Different Applications

Technical Specification

  • Gold Wire Diameter 17-75µm (0.7 – 3 mil)
  • Aluminium Wire Diameter 17-75µm (0.7 – 3mil
  • Ribbon Size up to 25×250µm (1×8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-1 seconds
  • Bond Force 5-130cNm
  • 90° Wire Feed Angle

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