Automatic Die Sorting & Inspection

Royce AP+


Product Description

A new automated die sorter to handle the output mediums your process requires (carrier tape, waffle pack, Gel-Pak, JEDEC tray, film frame, grip ring, and custom trays). The AP+ can pick die from wafer, waffle pack, Gel-Pak, JEDEC tray, or custom tray using an input map, perform an optional 180 degree die flip, and place to output, while maintaining input to output traceability at the die level. With its multi-project (pizza map or reticule mask) wafer mapping capability and quick-change fixtures and tooling, this system gives you the highest level of flexibility while maintaining fast change over between processes to support low to medium volume, high mix environments.

The system is very flexible and easy to set up. Ideal for high mix, medium volume production or prototyping. Wafer sizes from 3 inch (150mm) to 12 inch (300mm) and film frames and rings of any type are easily accommodated. Designed for quick change over of new die sizes with drop in output tooling. Our flexible wafer mapping approach and rich die binning options enables rapid accommodation of both current and legacy wafer map formats. Some applications involve die surfaces which cannot be touched by conventional surface vacuum pick up tips. Our unique optional Non Surface Contact (NSC) technology readily solves this problem. Examples include GaAs die with air bridges, biochips and ink jet heads. Die inversion (die flipping) is also an option, making inline inversion of bumped die into output trays a simple process. Royce die sorters have uniquely solved many die handling problems in Laser Diodes, MEMS, Microfluidics, Ink Jet head, Lab on Chip (LOC) and BioChip manufacturing. Let our experienced applications engineers help you configure the Autoplacer MP300 to meet your needs.

Key Features

  • Highly Flexible, Low Cost, Fully Automatic Pick and Place
  • Designed for Automatic Die Sorting from Wafer Maps, Including Multi Project Wafers (Pizza Masks)
  • Easy to set up with DieSort Manager Software and Expanded Wafer Map Library
  • Fast Change to New Die Size and Output Medium with Pre-Leveled Output Fixtures
  • Flexible Platform Handling 3 inch to 300 mm Wafers on Many Hoop and Frame Types
  • Picks at Programmable Heights, Speeds and with NSC Edge Grippers or Vacuum Pick-up

Technical Specification

  • Die Size Range 0.2 mm sq to > 25 mm sq for tray placement, 0.5 um sq to approx. 17 mm sq for tape placement
  • Pick-up Technology including surface or top edge contact vacuum tips
  • Optional non-surface contact Vespel edge grip
  • Placement repeatability of ± 12.5 micron
  • Die Sort Modes include Wafer mapping, Ink dot recognition and Pick all die
  • Throughput application dependent, 1.3 seconds minimum time per cycle
  • Die Input Film frames or wafer rings, in all current designs, for wafers up to 300 mm diameter
  • Waffle packs, Gel-Paks, JEDEC trays, and custom trays
  • Options Die Inverter, Post-Place Vision Inspection of Die in Carrier Tape

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