Manual & Semi-Automatic Wire Bonding

Wire bonding is a crucial step in microelectronics manufacturing where semiconductor devices are connected to their packaging using fine wire, ribbon, or heavy wire. This process can be done in different ways, such as ball bonding and wedge bonding, each suitable for specific applications.

Modern wire bonders offer high precision and flexibility, equipped with features like motorized axes for precise placement and control. These wire bonding machines are designed to meet the needs of various production scales, from small-scale laboratories to high-volume manufacturing lines.

Advanced wire bonders also come with user-friendly interfaces and software to enhance ease of use and efficiency. These systems are versatile, allowing seamless switching between different wire bonding methods, making them suitable for industries such as semiconductor manufacturing, aerospace, and medical device manufacturing.

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