Wire bonding is a critical process in microelectronics manufacturing, involving the connection of semiconductor devices to their packaging using fine wire, ribbon or heavy wire. This process can be performed using various techniques, including ball bonding and wedge bonding, each suitable for different applications. Modern wire bonders offer high precision and flexibility, with features like motorized axes for accurate placement and control. These machines are designed for a range of production scales, from small-scale laboratory settings to high-volume manufacturing lines. Advanced wire bonders also incorporate user-friendly interfaces and software, enhancing ease of use and efficiency. The versatility of these systems allows for seamless switching between different bonding methods, catering to the diverse needs of industries such as semiconductor, aerospace, and medical device manufacturing.
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