3D MXI (Offline)

Modern 3D X-ray inspection technologies offer unparalleled versatility and precision, enabling detailed analysis of a wide range of materials and components in the electronics and microelectronics sectors. 3D MXI manual systems (offline) are adept at examining a diverse array of items, from basic materials like aluminum, steel, and super alloys to complex electronic assemblies and parts used in cutting-edge applications.

For the manufacturing and quality assurance of electronic components, X-ray systems are indispensable. They provide key insights into PCBs, including BGA, LGA, QFN/QFP, THT, IGBT, and LED structures, ensuring that even the most minute defects like voids are detected. This capability extends to semiconductor applications, where the inspection of wafers, integrated circuits (ICs), die attach connections, 3D IC joints, through-silicon vias (TSVs), sensors, MEMS, and MOEMS is indispensable for maintaining the high standards required in today’s technology-driven world.

Beyond traditional electronics, these X-ray systems play a vital role in inspecting additively manufactured parts, revealing the internal structure and integrity of components made from complex layering processes. Battery cells, modules, and systems, as well as fiber-reinforced composites and plastic injection molded parts, are also within their purview, supporting the development and quality control of energy storage devices and durable materials.

The scope of X-ray inspection extends into the realms of cultural preservation and scientific research, where it is used to examine historical artifacts, art, and archaeological finds without causing damage. Similarly, geological, paleontological, and biological samples can be analyzed in detail, offering insights into the natural world that were previously unattainable.

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