COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

MicroTech, IMAPS Annual Conference 2018

Accelonix Ltd is proud to announce Gold Sponsorship of MicroTech 2018

Coinciding with the 50th anniversary of IMAPS-UK, MicroTech 2018 promises to be the UK’s largest Microelectronics and Advanced Packaging conference. Located at the stunning Windsor Conference Building at Royal Holloway, London University, the conference provides the ideal venue for attendees to connect with exhibitors and experts across the Microelectronics industry. Accelonix will be on site showcasing products & services throughout the day in the beautiful surroundings of the Windsor Building. For further information or to register for this event visit https://www.imaps.org.uk/.

CoNEXTions Technology Day 2018

CoNEXTions Technology Day Announcement!

Join Accelonix Ltd and Altus Group Ltd on 8th of March 2018 at the prestigious MTC facility in Coventry. We will be demonstrating some of the latest and best PCB Test Equipment such as the popular TAKAYA APT-1400 Flying Probe Tester, the powerful Data I/O PSV5000 for automated device programming, the Koh Young 3D Automated Optical Inspection system from Koh Young, and much more! In addition, get to know our speakers, network and watch these impressive machines that are continuously improving test processes throughout the UK and Ireland.

This year we have an exciting list of guest speakers from Accelonix and Altus, whom will be discussing the latest technologies, concepts and presenting interesting case studies of their own experiences with some of the remarkable systems that will be on exhibit. Meet Mr Helmut Pflaum, MD from Data IO, whom will be presenting the latest in-programming solutions for semiconductor devices.

Find out why the APT-1400 TAKAYA Flying Probe Tester is so effective in providing excellent coverage results and fast turn-around times with Sales Manager, Miroslav Stanisavljević from Systech Europe. Further, learn how you can implement strategies in your business to digitalise your production processes and become a ‘smart factory’, with Sales Manager Oliver Glub from Siemens.

Discover hot topics like industry 4.0 and digitalisation with Sales Manager, Ignace Braem from Siemens, whom will be discussing how you can achieve ‘smart factory’ status and meet traceability requirements with eMES (Electronics Manufacturing Execution Software).

For more information about the event, speakers and schedule: please click here.

To register for the event please email: This email address is being protected from spambots. You need JavaScript enabled to view it.

Or Call: 01223 659966

IMAPS 2018 Advanced Packaging for Compound Semiconductor Applications Conference 2018

IMAPs-UK’s Advanced Packaging for Compound Semiconductor Applications Conference 2018

Accelonix Ltd was proud to participate in this year’s Advanced Packaging for Compound Semiconductor Applications conference, which took place on 8th February 2018, in Birmingham. This one-day event focused on advanced packaging solutions specifically addressing the challenges associated with compound semiconductor packaging applications.

The workshop included an array of electronics packaging experts and practitioners to present a comprehensive review of advanced packaging technologies applied in power electronics, photonics, RF/Microwave and sensing, where compound semiconductors are already making a big impact.

Darren Harvey, Sales and Applications Engineer for Microelectronics at Accelonix, delivered a presentation entitled “Addressing Compound Semiconductor Packaging Challenges”, covering three key technologies: Die attach sintering for high-power devices, which included the handling of fragile compound semiconductors; Vacuum potting for high power applications; and Vacuum soldering for high power, high reliability applications.