Accelonix presents The Hyperion

Accelonix welcomes a new addition to its GPD dispensing portfolio. The Hyperion from GPD-Global is a cutting-edge, compact and efficient system which comes with a host of features that will take your manufacturing experience to the next level.

Accelonix present New Hesse Products

Accelonix are pleased to announce the addition of three New Generation Hesse Wire bonding systems to our Microelectronics portfolio.

Accelonix hosts Wire Bonding discussions with university academics at the MTC, 11^th May 2017

Accelonix are proud to collaborate with Universities across the UK & Ireland.

Accelonix hosted a meeting at the MTC (Manufacturing Technology Centre, Coventry) with key University Wire Bonding staff covering a range of topics including: Metrology, Warpage, Product Lifecycle Management, Quality Assurance, Encapsulation and Wire Bonding methods.

Academics attended from RAL, Universities of Oxford, Liverpool, Birmingham, Glasgow, Queen Mary, Edinburgh, Sheffield, Cambridge, and University of California – Santa Barbara.

Discussions lead to interesting topics such as information on quality assurance and an assembly tracking database for ATLAS upgrade.

“All of the talks were beneficial and contributed greatly to the conversations and networking in the breaks”, says Gale Lockwood, organiser for Oxford University.

The day included a “show and tell” session, getting everyone involved and stretching their imagination in understanding the possibilities with wire-bonding convention. It was a privilege to have Dr. Hesse from Hesse Mechatronics join the event and provide an insight on the Hesse machines. This was a fantastic opportunity to communicate and have questions answered.

The event concluded with a tour of the impressive MTC, with an overview of the facilities provided and detailed demonstrations of select equipment.