Table Top Shadow Moiré  Warpage Metrology tool

Table Top Warpage Metrology Technology from Akrometrix

To complement their range of Thermal Warpage Metrology Solutions, Akrometrix have launched their latest addition. The TTSM, Table Top Shadow Moiré  Warpage Metrology tool is an ideal solution to room temperature surface warpage measurement. Suited to inline use as well, the TTSM uses Shadow Moiré technology to provide fast results when measuring substrates to 330 mm square, and offers full field of view measurement of 1.2 million data points in under two seconds.

HB100 Automatic Wire Bonder

TPT release the HB100 Automatic Wire Bonder

The time has come for TPT to go from manual to automatic. Accelonix are pleased to introduce the new HB100 Automatic Wire Bonder to the microelectronics portfolio. Providing modern, effective, wire bonding solutions with the top of the range desktop wire bonders on the market.

psv5000 400x300

Accelonix presents The PSV5000

Accelonix are proud to present the latest, high performance and affordable PSV5000 to the circuit test and device programming portfolio. This efficient machine from Data I/O, offers market leading precision with maximum throughput, keeping you ahead of the game.