Hesse Mechatronics

Accelonix present New Hesse Products

Accelonix are pleased to announce the addition of three New Generation Hesse Wire bonding systems to our Microelectronics portfolio.

The New Bondjet BJ653, with its changeable bond heads, is capable of wedge-wedge wire bonding as well as ball-wedge wire bonding and can handle fine wire, heavy wire and ribbon. This flexible machine is perfectly suited to the UK & Irish markets and provides trade market Hesse quality along with opens access and multi-purpose capability.

The New BJ955 & BJ959 are latest generation ultrasonic heavy wire wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. In addition to recognised Hesse quality, the systems feature optimised pattern recognition as well as software features to meet the growing demand of connectivity and industry 4.0

Lastly, the New Very Large area BJ985 ultrasonic heavy wire wedge-wedge bonder developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other materials.

All systems can be used as fully automatic machines or operated manually and perfectly meet the varied and challenging requirements of the modern Microelectronics industry.