SST International

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SST designs, manufactures, delivers and supports equipment, tooling and services for thermal processes used in the assembly of microelectronic devices.

They deliver both standard and custom vacuum furnaces and wafer bonders with specialized capabilities to produce the highest quality results. SST have delivered over 1200 systems to more than 400 leading companies worldwide.

They support this equipment with custom-designed tooling and fixtures to meet the needs of each customer's application. SST provide process development support, equipment and process training, and parts and service.

Model 1200 Table Top Furnace

Model 1200 Table Top Furnace is used for process development and low volume production soldering of microelectronic packages and components.

Model 1500 Wafer Aligner

Model 1500 Wafer Aligner is used for precise alignment of wafers up to 200 mm in diameter.

Model 3130 Vacuum Pressure Furnace

Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components.

Model 3150 High Vacuum Furnace

Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.

Model 3180 Wafer Bonder

Model 3180 Wafer Bonder is used for bonding wafers at high temperatures, under vacuum or inert gas, with a high mechanical bonding force.

Model 3250 High Vacuum Wafer Furnace

Model 3250 High Vacuum Wafer Furnace is used for high vacuum soldering and bonding of components and wafers up to 8-inch (200 mm) diameter.

Model 5100 Vacuum Pressure Furnace

Model 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components.

Model AVS-4000 Automated High Vacuum Furnace

Model AVS-4000 Automated High Vacuum Furnace is used for high vacuum sealing of MEMS packages and other automated soldering processes.