Semi Automatic Wire Bonder

TPT Wire bonders have been designing and manufacturing wire bonders since 1996. They are a privately owned company providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry, from Universities and colleges to leading semiconductor, aerospace and medical device manufactures. TPT was the first company to produce a wire bonder capable of both wedge and ball bonding, simply by changing the tool, a feature that is available across the range of fine wire bonders.

TPT HB100 Automatic Wedge and Ball Bonder
HB100

The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis and bondhead rotation. Perfectly suited for laboratories and small volume productions. This versatile machine can perform wedge and ball bonding with a single bond head. With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.

TPT HB16 Semi-Automatic Wire Bonder
HB16

The HB16 series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine. The HB16 series also benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

TPT HB30 Semi-Automatic Heavy Wire Bonder
HB30

The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

TPT HB10 Semi-Automatic Wire Bonder
HB10

The HB10 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine. The HB10 series also benefits from a motorised Z axis giving more control over the looping of the wire.

TPT HB05 Manual Wire Bonder
HB05

The HB05 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

TPT HB75 Semi-Automatic Die Bonder
HB75

The HB75 is a bench top size semi-automatic Die Bonder, ideal for laboratories, pilot and small-scale production lines. Easy operation is achieved via a TFT touch screen for direct access and simple adjustment of all parameters. It is a flexible system, easily tailored towards your die bonding needs. The system is equipped with a rotating head for quick change during die-placement. Epoxy can be dispensed or stamped.

TPT HB70 Manual Die Bonder
HB70

The HB70 is a bench top size Die Bonder, ideal for laboratories, pilot and small scale production lines. A flexible system, easily tailored towards your die bonding needs.