Royce Instruments

For over 25 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment. Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak.

Royce Instruments equipment is utilized throughout the world by the leading semiconductor and photonics manufacturers, assembly subcontractors, computer manufacturers, aerospace companies, and most of the world's largest auto and medical electronics device manufacturers.

Royce 610 Multitest Bond Tester
Royce 610

The Royce 610 Dedicated Wire Pull Bond Tester is designed for maximum throughput at an affordable cost, in a reliable system. The controls of the 610 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 610 easily adjusts to accommodate a broad spectrum of users.

Royce 620 Multitest Bond Tester
Royce 620

The Royce 620 Multitest Bond Tester offers an attractive bond test solution that is midway between the Royce 650 and the Royce 610. It performs all the most frequently used applications, and it employs manual sample positioning, which in some applications allows for higher productivity over a motorized XY stage.

Royce 650 Universal Bond Tester
Royce 650

The Royce 650 bond tester is the latest bond tester by Royce, which can be used to pull test, bond shear and die shear. It has a very user friendly S/W, which can be readily networked and the system has industry leading accuracy. The 650 system can also automatically collate and export a wide variety of SPC data, to ensure that quality of production can be easily tracked.

Royce AP+ Automated Die Sorter
AP plus

A new automated die sorter to handle the output mediums your process requires (carrier tape, waffle pack, Gel-Pak, JEDEC tray, film frame, grip ring, and custom trays). The AP+ can pick die from wafer, waffle pack, Gel-Pak, JEDEC tray, or custom tray using an input map, perform an optional 180 degree die flip, and place to output, while maintaining input to output traceability at the die level.

Royce DE35-ST Die Sorter
Royce DE35

The DE35-ST semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Pak®, film frame or directly onto substrates. The DE35-ST eliminates the inefficiencies and down time usually found in small lot production. Simple to learn and use, the DE35-ST requires no hand tools for die size changeover and setup.