Hesse Mechatronics

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BJ820 Fine Wire Bonder
BJ830 Large Area Ball-Wedge Bonder
BJ931 Dual Head Leadframe Wedge Bonder
BJ935 939 Heavy Wire Bonder
BJ980 Heavy Wire Wedge Bonder
BJ520 Ultrasonic Flipchip Bonder

Hesse Mechatronics GmbH, formerly 'Hesse & Knipps' is a world leader in the field of ultrasonic welding technology for the microelectronics and semiconductor industries. Hesse Mechatronics have been working in the field of industrial automation since 1986 and in 1995 began the start of a successful business building and selling high tech equipment for the semiconductor industry. Their headquarters along with their manufacturing facilities are located in Paderborn, Germany. Hesse develops and delivers customer specific equipment for the back-end: heavy wire and thin wire wedge bonder, ultrasonic flipchip bonder and special systems right up to complete production lines.

Core competence is the consistent customer orientation, high innovation power and the application of state of the art technology. We invest in all relevant technologies to achieve maximum technical abilities and with the interaction of mechanics, electrics/electronics and software we are able to generate optimum solutions. For example, one development which gained world-wide recognition is the development of a series of wear-free piezo bondheads in a simplistic construction. Another example is the patented process integrated quality control which measures friction, frequency, current, voltage and deformation in real-time.

Hesse Mechatronics BJ820
BJ820 Fine Wire Bonder

The Bondjet BJ820 is the world´s leading fully automated fine wire wedge bonder.

BJ830 Large Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated, thermosonic fine wire ball-wedge bonder with a large working area.

BJ931 Dual Head Leadframe Wedge Bonder

The Bondjet BJ931 is an ultrasonic wedge bonder developed especially for matrix leadframe applications. The application of two bondheads enables it to bond two different wire sizes as well as a combination of wire and ribbon.

BJ935/BJ939 Heavy Wire Bonder

The Bondjet BJ935/939 is an ultrasonic wedge-wedge bonder developed for the fully automated processing of a wide range of substrates, chips and other materials. The system can be used as a fully automatic machine or operated manually.

BJ980 Heavy Wire Wedge Bonder

The newly developed ultrasonic wedge-wedge bonder BJ980, has a flexible and largest working area of 305 mm, 370 mm or 700 mm x 1132 mm, the growing demands for large-sized substrates, especially for solar and applications.

BJ520 Ultrasonic Flipchip Bonder

The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible.