Wafer Applications
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Wafer 1 Surface Map
wafer thickness map
Wafer2 surface
warpage3D surface
Wafer manufacture can require several parameters to be assessed in the manufacturing process. Typical requirements are for flatness of the wafer, total thickness variation, as well as assessing the quality of the image printed on the surface.

The 2D and 3D non-contact measurement solutions from cyberTECHNOLOGIES GmbH have been used in many industries around the world to provide solutions to these and other issues.

The technology allows for scanning over large surfaces very quickly when looking at flatness. The platforms available are capable of measuring surfaces greater than 300 mm diameter. Surface flatness down to 0.1 nm can be resolved using 3D White Light Interferometry. Utilising the CT “T” series products, sensors above and below the supporting frame will provide Total Thickness Variation, and it is practical to measure features of 2 µm diameter, quickly and automatically.

The SCAN CT software suite covers all aspects of setting up, scanning, data acquisition, analysis and reporting, with the additional ASCAN software to provide test and analysis automation for the production line.
  • Area sensors for super smooth surface roughness and small features
  • Point sensors for Wafer flatness and medium feature measurement
  • Table sizes for wafer diameters greater than 300 mm
  • Multiple sensor installations for differing measurement requirements
  • Top and bottom sensor configuration for TTV
  • Full automation of scanning and analysis
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