We are pleased to announce that we will be exhibiting at Advanced Engineering 2019 show, the UK’s largest annual exhibition and conference for advanced manufacturers & supply chain professionals, taking place on 30th and 31st October 2019 at the NEC in Birmingham.
Our focus for this year’s Advanced Engineering show will be Scheugenpflug dispensing technology and Hesse Ultrasonic Wire Bonding platforms for use in Power Electronics and HV battery manufacturing processes.
Scheugenpflug AG provides industrial solutions for material dispensing, potting and coating. On stand G7 we will be showcasing their Dispensing Cell. The entry-level solution for dispensing applications, the system includes a 3-axis-system and a light curtain as well as the proven Dos P016 and the cartridge expulsion unit A90 C with filling level monitoring. Suitable for small to medium batch sizes, its typical applications include heat dissipation, adhesive bonding, thermally conductive paste, epoxy resin, polyurethane resin and silicone resin.
Hesse’s latest generation of fully automatic wire bonders offer advanced ultrasonic bonding technologies for fine wire and heavy wire bonding applications.; high speed, large area ultrasonic bonding solutions for wedge bonding, ball bonding and ribbon bonding processes. Innovative technical advancements, such as Process Integrated Quality Control or wear-free piezo bondheads, position Hesse at the leading edge of ultrasonic wire bonding technology.
Visit http://www.advancedengineeringuk.com/ to find out more and register for your free pass.