PARMI: 3D AOI & SPI
Founded in 1998, PARMI has always been synonymous with innovation. They are not just another SPI & AOI solutions provider, but a true solutions partner with a goal to add value to your business. Whether we are helping you increase your PCB yield and throughput, solve a unique challenge, or increase your ROI, Parmi systems give you a competitive edge. Parmi have developed their new generation Xceed 3D AOI (Automated Optical Inspection) and their SIGMAX 3D SPI (Solder Paste Inspection) systems for todays discerning users who require ‘Smart Inspection’ techniques, that give them clear, accurate, repeatable and fast results.
Their shadow free, dual-laser optical triangulation measuring principle, with high speed CMOS4 mega pixel camera, ensures an industry leading world class performance. The advantage of a simple user interface and ease of programming, guarantees an effective quality gate in identifying all defects. UK support from the Accelonix trained engineers will ensure your AOI/SPI system will consistently give you excellent service, repeatable test results and zero defects.

The Parmi Xceed New Generation 3D AOI range of systems can detect all defect types that relate to component placing and soldering. It's high speed CMOS camera with dual-laser technology can easily identify missing, lifted, misaligned and tomb-stoned components. As well as, checking polarity of all devices.

The Parmi SIGMA X, World Class 3D Solder Paste Inspection system uses a real 3D image which utilises an inspection technology that is unaffected by varying materials, surface conditions or colours. The systems profiles the board to generate accurate 3D shapes which are far superior to other brands and technologies.