Metrology Services

Accelonix Ltd have extended their contract testing capabilities to include surface measurement of electronic board, wafer and component testing. This compliments the existing services for low, medium and high volume board testing. The Staplehurst facility has a 2 and 3D non-contact surface measurement system from Cyber Technologies Gmbh.

Key measurement capabilities include:

Thickfilm measurement of surface layers including hybrid, solar cell, epoxy print, MLCC and fuel cells for profile and thickness.

Flatness for Electronic components, sensors, silicon wafers and hard disc drive components.

Surface roughness for measurement of etching and surface defect detection.

Transparent film and deposit measurement such as flux and epoxy, including substances not visible with microscopy or AOI systems.

Coplanarity for SMT components and Micro BGA.

Thickness for absolute measurement and TTV, bending and Warpage for wafers and components

CT100 measurement capacity

The CT100 system is a scanning point based confocal white light non-contact surface measurement system.
Key Features are

Moving platform travel range 150mm x 150mm
Motorized Z-axis to 30mm product height
Spot size 3.5um
Measurement range 1mm with range extension for seemless contoured product testing
Resolution to 35nm vertical and 1.5um horizontal
Working height above measured surface 20.8mm
Maximum feature height 19.5 mm above surface
Reporting options include SPC, 3D image production
Traceable calibration and certfication