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COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

The VS320 Vacuum Soldering System is a free standing production solution with capability for Integrated Plasma Cleaning.

VS320 Vacuum Soldering System
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Budatec VS320 Vacuum Soldering System
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Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. The VS320 Vacuum Soldering System is a free standing production solution with capability for integrated Plasma Cleaning. The VS320 Vacuum Soldering System is a free standing production solution with capability for Integrated Plasma Cleaning.
  • Soldering processes up to 450°C with and without flux
  • Short process times from 6 min via extremely fast heating and cooling rates and short suction and rinsing cycles
  • All commonly used vacuum brazing technology gases can be used such as nitrogen, hydrogen, forming gases
  • Integrated cleaning steps using formic acid, hydrogen reduction and plasma
  • Plate size: 320mm x 320mm
  • Max. substrate height: 100mm
  • Max. solder temperature: 450°C
  • heat up / cool down: max. 2.5K/s
  • Possible process gases: N2; N2H2 95/5% H2 bis 100%
  • Max. load: 15kg
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For further information please visit www.budatec.com