The VS320 Vacuum Soldering System is a free standing production solution with capability for Integrated Plasma Cleaning.

VS320 Vacuum Soldering System
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Budatec VS320 Vacuum Soldering System
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Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. The VS320 Vacuum Soldering System is a free standing production solution with capability for integrated Plasma Cleaning. The VS320 Vacuum Soldering System is a free standing production solution with capability for Integrated Plasma Cleaning.
  • Soldering processes up to 450°C with and without flux
  • Short process times from 6 min via extremely fast heating and cooling rates and short suction and rinsing cycles
  • All commonly used vacuum brazing technology gases can be used such as nitrogen, hydrogen, forming gases
  • Integrated cleaning steps using formic acid, hydrogen reduction and plasma
  • Plate size: 320mm x 320mm
  • Max. substrate height: 100mm
  • Max. solder temperature: 450°C
  • heat up / cool down: max. 2.5K/s
  • Possible process gases: N2; N2H2 95/5% H2 bis 100%
  • Max. load: 15kg
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For further information please visit www.budatec.com