COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

Models 8301 and 8303

Model 8301 Vacuum Pressure Furnace
SST logo
Model 8303 Vacuum Pressure Furnace
The SST 8300 Series is an automated vacuum pressure soldering system designed to deliver a reliable, better than industry standard void rate, low-void, flux-less solder process. The system uses precise combination of vacuum and gas pressure and features oxide removal technology using formic acid or forming gas. Featuring conveyor belts and a Cartesian gantry, the SST 8300 Series provides high volume, high reliable packages through precise control of the soldering process. The system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit. Unique edge heating elements enable the chamber to achieve temperature uniformity over the entire target plate. Available with a single (SST 8301) or triple (SST 8303) chamber, the SST 8300 Series can operate as a stand-alone unit or can be integrated into an automated production line; each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel. The user-friendly software interface provides a graphic review of data for real-time process analysis.
  • Automated High-Volume Production
  • Low-Void, Flux-Less Solder Process
  • Flexible Configuration: single or triple oven; standalone or integrated
  • Power Module Assembly
  • Hermetic Sealing of Hi-Rel Packages
  • High Intensity LED Attach
  • Hermetic Sealing of IR Image Sensors
  • CPV Solar Cell Assembly
  • Operating Temperature Range: Room temperature to 500°C
  • Thermal Process Area: 13 X 18.5 in. (330 x 470 mm)
  • Chamber size (SST 8303): 15.9 X 22.5 in. (404 x 571 mm)
  • Minimum Vacuum Level: <50 millitorr (<0.067 mBar)
  • Maximum Chamber Gas Pressure Level: 40 psig (3.8 Bar)
  • Process Gasses: N2 plus one additional. Third gas is optional (GAS3)



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For further information please visit www.sstinternational.com