Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.

Model 3150 High Vacuum Furnace
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Model 3150 High Vacuum Furnace
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Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.The 3150 high vacuum furnace is offered by SST International for high-reliability microelectronic package assembly. Packages are hermetically sealed with very low internal gas pressures and moisture levels. Prior to package sealing, integral getters may also be activated to ensure long-term internal package vacuum levels.
The 3150 system provides precise automatic control of both heating and cooling. Temperatures up to 500°C are easily achieved in vacuum levels below 1 x 10-7 torr and in positive inert gas pressures up to 15 psig. The 3150 utilizes a turbomolecular drag pump for the best pumping of hydrogen gas molecules. An optional cryogenic water pump may be added to the system for processes requiring extremely low levels of residual water vapor. The system is backed by an oil-free roughing pump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is included, permitting remote monitoring, troubleshooting and maintenance capabilities. Custom designed resistive graphite heating fixtures (ordered separately) are matched to user application requirements for optimum system performance. An automatically controlled linear motion stage provides component separation during thermal processing and getter activation.
  • MEMS Package Sealing
  • Getter Activation
  • Void-Free Eutectic Die Attach
  • Hermetic Package Sealing
  • Military Electronic Package Sealing
  • Operating Temperature Range: 100 to 500°C (1000°C optional)
  • Thermal Work Zone: 25 in2 (160 cm2)
  • Minimum Vacuum Level: 1 x 10-7 torr (1 x 10-7 mbar)
  • Maximum Chamber Gas Pressure Level: 12 psig (1.8 bar)
  • Process Gasses: N2 required, (Ar, He, forming gas optional) at 90 psig (7 bar) minimum pressure
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