Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components.

Model 3130 Vacuum Pressure Furnace
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Model 3130
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Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components. The 3130 is a programmable vacuum and pressure furnace offered by SST International for high reliability microelectronic package assembly. Advanced technology, provided by the system, allows users to create void-free solder joints without the use of flux. The system is used in both production and research environments.
The system provides precise automatic control of heating and cooling up to 500°C in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Machine control is provided by an embedded control system operating in a Microsoft Windows environment, on an Intel Pentium processor. Process profiles are easily created, and archived for SPC and subsequent off-line data analysis. Internet and Intranet network connectivity is available a s an option. Custom designed, resistive graphite heating fixtures (ordered separately) are matched to customer application requirements for optimum system performance.
  • Fiber Optic Package Assembly
  • MMIC Attach
  • Die, Component and Substrate Solder Attach
  • Hermetic Package Sealing
  • Implantable Medical Devices
  • Operating Temperature Range: 100 to 500°C (1000°C optional)
  • Thermal Work Zone: 35 in2 (225 cm2) maximum
  • Minimum Vacuum Level: < 50 millitorr (< 0.067 mbar)
  • Maximum Chamber Gas Pressure Level: 60 psig (5 bar)
  • Process Gasses: N2 required, (Ar He, forming gas optional) at 90 psig (7 bar) minimum pressure
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For further information please visit www.sstinternational.com