TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB30 Semi-Automatic Heavy Wire Bonder

TPT HB30 Semi-Automatic Heavy Wire Bonder Bondhead

The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

Features

Motorised Z Bondhead
Motorised Y travel for Step-Back Control
Intuitive Interface with Touch Screen Control
Stitch Bonding
Built-in Dual Fibre Optic Illuminator
Loop Profile Software
Semi-Automatic, Step and Manual Bonding Mode
100 Program Storage Capacity

Technical Specification

Aluminium Wire Diameter 100µm - 500µm
PLL US System
Ribbon Sizes up to 300µm x 2000µm
Ultrasonic Power 20 Watt Output
Bond Time 0-10 seconds
Bond Force 5-1500cNm
90° Wire Feed Angle
Loop profiles consisting of up to 10 steps

Downloadable PDFs

HB30 Datasheet

Quick Enquiry Form

Please complete and submit the form with you name, contact details and a brief description of your enquiry.

We are always pleased to hear from you.

A member of the Accelonix team will respond back to you as soon as possible

For further information please visit www.tpt-wirebonder.com

Service and Support

Latest news

Our Partners

TPT HB30 Semi-Automatic Heavy Wire Bonder