TPT HB30 Semi-Automatic Heavy Wire Bonder
The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.
- Motorised Z Bondhead
- Motorised Y travel for Step-Back Control
- Intuitive Interface with Touch Screen Control
- Stitch Bonding
- Built-in Dual Fibre Optic Illuminator
- Loop Profile Software
- Semi-Automatic, Step and Manual Bonding Mode
- 100 Program Storage Capacity
- Aluminium Wire Diameter 100µm - 500µm
- PLL US System
- Ribbon Sizes up to 300µm x 2000µm
- Ultrasonic Power 20 Watt Output
- Bond Time 0-10 seconds
- Bond Force 5-1500cNm
- 90° Wire Feed Angle
- Loop profiles consisting of up to 10 steps
For further information please visit www.tpt-wirebonder.com