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COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

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TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB30 Semi-Automatic Heavy Wire Bonder

TPT HB30 Semi-Automatic Heavy Wire Bonder
TPT Wire bonder Logo
TPT HB30 Semi-Automatic Heavy Wire Bonder Bondhead
TPT Wire Bonder Heavy Ribbon Bonds
TPT Wire Bonder Heavy Wire Bonds
TPT Wire Bonder Heavy Ribbon Bonds 2
The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.
  • Motorised Z Bondhead
  • Motorised Y travel for Step-Back Control
  • Intuitive Interface with Touch Screen Control
  • Stitch Bonding
  • Built-in Dual Fibre Optic Illuminator
  • Loop Profile Software
  • Semi-Automatic, Step and Manual Bonding Mode
  • 100 Program Storage Capacity
  • Aluminium Wire Diameter 100µm - 500µm
  • PLL US System
  • Ribbon Sizes up to 300µm x 2000µm
  • Ultrasonic Power 20 Watt Output
  • Bond Time 0-10 seconds
  • Bond Force 5-1500cNm
  • 90° Wire Feed Angle
  • Loop profiles consisting of up to 10 steps
HB30 Datasheet

For further information please visit www.tpt-wirebonder.com