TPT have been designing and manufacturing wire bonders since 1996 and provide the highest quality equipment to the microelectronics industry,

TPT HB05 Manual Wire Bonder
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TPT HB05 Manual Wire Bonder
TPT Wire Bonder Logo
TPT Wire Bonder Ball Bonds
TPT HB05 Manual Wire Bonder Interface
TPT Wire Bonder Gold Wedge Bonds
TPT Wire Bonder Wire Bond Wedge
TPT Wire Bonder Ball Wedge Bond
The HB05 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user with access to all of the bond parameters and bonding recepies stored on the machine.
  • Motorized Tail Control
  • 4" TFT Display for Easy Control of all Bond Parameters
  • Simple Change between Ball Bonding and Wedge Bonding
  • Deep Access Bondhead
  • Electronic Wire Clamp for Precise Tail Length Control
  • Easy Setting Recall when Working on Different Applications
  • Gold Wire Diameter 17-75µm (0.7 - 3 mil)
  • Aluminium Wire Diameter 17-75µm (0.7 - 3mil
  • Ribbon Size up to 25x250µm (1x8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-1 seconds
  • Bond Force 5-130cNm
  • 90° Wire Feed Angle
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For further information please visit www.tpt-wirebonder.com