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COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB75 Semi-Automatic Die Attach Bonder
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TPT HB75 Semi-Automatic Die Attach Bonder
TPT Wire Bonder Logo
TPT Die Place
Epoxy Dispence
controller
TPT HB75 Semi-Automatic Die Attach Bonder
TPT HB75 Semi-Automatic Die Attach Bonder
The HB75 is a bench top size semi-automatic Die Attach Bonder, ideal for laboratories, pilot and small-scale production lines. Easy operation is achieved via a TFT touch screen for direct access and simple adjustment of all parameters. It is a flexible system, easily tailored towards your die bonding needs. The system is equipped with a rotating head for quick change during die-placement. Epoxy can be dispensed or stamped.
  • Die placement with precise movements
  • Epoxy stamping and optional Epoxy dispensing
  • Rotational head for quick switch between Die Attach dispensing and Die Placement
  • Pick Die from Waffle Packs and place on to your substrate
  • 6.5" TFT Touch Screen
  • Semi-automatic and Manual modes
  • True Vertical Movement
  • Integrated Vacuum pump
  • Min Die Size: 100um x 100um
  • Max Die Size: 10mm x 10mm
  • Bond time: 1ms - 10,000ms (1ms - 20,000ms optional)
  • Bond Force: 10-150cNm ( 350cNm optional)
  • Motorised Z- way: 17mm (0.67")
  • Bond Arm Length: 165mm (6.7")
  • X-y Manipulator: 10mm (0.4")
  • Tempearture Control: Up to 250degC +/- 1degC
  • CE Standard

For further information please visit www.tpt-wirebonder.com