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TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB75 Semi-Automatic Die Attach Bonder
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TPT HB75 Semi-Automatic Die Attach Bonder
TPT Wire Bonder Logo
TPT Die Place
Epoxy Dispence
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TPT HB75 Semi-Automatic Die Attach Bonder
TPT HB75 Semi-Automatic Die Attach Bonder
The HB75 is a bench top size semi-automatic Die Attach Bonder, ideal for laboratories, pilot and small-scale production lines. Easy operation is achieved via a TFT touch screen for direct access and simple adjustment of all parameters. It is a flexible system, easily tailored towards your die bonding needs. The system is equipped with a rotating head for quick change during die-placement. Epoxy can be dispensed or stamped.
  • Die placement with precise movements
  • Epoxy stamping and optional Epoxy dispensing
  • Rotational head for quick switch between Die Attach dispensing and Die Placement
  • Pick Die from Waffle Packs and place on to your substrate
  • 6.5" TFT Touch Screen
  • Semi-automatic and Manual modes
  • True Vertical Movement
  • Integrated Vacuum pump
  • Min Die Size: 100um x 100um
  • Max Die Size: 10mm x 10mm
  • Bond time: 1ms - 10,000ms (1ms - 20,000ms optional)
  • Bond Force: 10-150cNm ( 350cNm optional)
  • Motorised Z- way: 17mm (0.67")
  • Bond Arm Length: 165mm (6.7")
  • X-y Manipulator: 10mm (0.4")
  • Tempearture Control: Up to 250degC +/- 1degC
  • CE Standard
HB75 Datasheet

For further information please visit www.tpt-wirebonder.com