TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB75 Semi-Automatic Die Attach Bonder

The HB75 is a bench top size semi-automatic Die Attach Bonder, ideal for laboratories, pilot and small-scale production lines. Easy operation is achieved via a TFT touch screen for direct access and simple adjustment of all parameters. It is a flexible system, easily tailored towards your die bonding needs. The system is equipped with a rotating head for quick change during die-placement. Epoxy can be dispensed or stamped.

Features

Die placement with precise movements
Epoxy stamping and optional Epoxy dispensing
Rotational head for quick switch between Die Attach dispensing and Die Placement
Pick Die from Waffle Packs and place on to your substrate
6.5" TFT Touch Screen
Semi-automatic and Manual modes
True Vertical Movement
Integrated Vacuum pump

Technical Specification

Min Die Size: 100um x 100um
Max Die Size: 10mm x 10mm
Bond time: 1ms - 10,000ms (1ms - 20,000ms optional)
Bond Force: 10-150cNm ( 350cNm optional)
Motorised Z- way: 17mm (0.67")
Bond Arm Length: 165mm (6.7")
X-y Manipulator: 10mm (0.4")
Tempearture Control: Up to 250degC +/- 1degC
CE Standard

Downloadable PDFs

HB75 Datasheet

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For further information please visit www.tpt-wirebonder.com

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TPT HB75 Semi-Automatic Die Attach Bonder

Service and Support

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TPT HB75 Semi-Automatic Die Attach Bonder