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TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry
TPT HB75 Semi-Automatic Die Attach Bonder
TPT HB75 Semi-Automatic Die Attach Bonder
The HB75 is a bench top size semi-automatic Die Attach Bonder, ideal for laboratories, pilot and small-scale production lines. Easy operation is achieved via a TFT touch screen for direct access and simple adjustment of all parameters. It is a flexible system, easily tailored towards your die bonding needs. The system is equipped with a rotating head for quick change during die-placement. Epoxy can be dispensed or stamped.
- Die placement with precise movements
- Epoxy stamping and optional Epoxy dispensing
- Rotational head for quick switch between Die Attach dispensing and Die Placement
- Pick Die from Waffle Packs and place on to your substrate
- 6.5" TFT Touch Screen
- Semi-automatic and Manual modes
- True Vertical Movement
- Integrated Vacuum pump
- Min Die Size: 100um x 100um
- Max Die Size: 10mm x 10mm
- Bond time: 1ms - 10,000ms (1ms - 20,000ms optional)
- Bond Force: 10-150cNm ( 350cNm optional)
- Motorised Z- way: 17mm (0.67")
- Bond Arm Length: 165mm (6.7")
- X-y Manipulator: 10mm (0.4")
- Tempearture Control: Up to 250degC +/- 1degC
- CE Standard
Please complete and submit the form with you name, contact details and a brief description of your enquiry.
We are always pleased to hear from you.
A member of the Accelonix team will respond back to you as soon as possible
We are always pleased to hear from you.
A member of the Accelonix team will respond back to you as soon as possible
For further information please visit www.tpt-wirebonder.com
