TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB70 Manual Die Attach Bonder
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TPT HB70 Manual Die Bonder
TPT Wire Bonder Logo
TPT HB70 Manual Die Bonder, Die Place
TPT HB70 Manual Die Bonder, Epoxy Dispence
TPT HB70 Manual Die Bonder
TPT HB70 Manual Die Bonder
TPT HB70 Manual Die Bonder
The HB70 is a bench top size Die Bonder, ideal for laboratories, pilot and small scale production lines. A flexible system, easily tailored towords your die bonding needs.
  • Pick Die from Waffle Packs and place on to your substrate
  • Motorized Z-axis with 90° linear movement
  • Exact placement of Die, Epoxy Stamp or Dispenser
  • Adjustable camera angle with optical zoom
  • Fast and precise stamping process
  • Visual inspection of micro-assembly
  • Pick & Place
  • True vertical Z movement
  • X-Y Micrometer screws
  • Auto Vacuum Pump
  • Epoxy Dispensing
  • Epoxy Stamping
  • Full HD Camera
  • Optional heater stage



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